Proprietary Process Technologies
Advanced fabrication and custom processing capabilities optimized for high-performance photonic and electronic devices.
III–V antimonide optoelectronic platforms
Antimonide
optoelectronics,
end to end
Precision in chips · Intelligence in light · Vision for the future.
GK Semiconductor connects the lattice-matched 6'' InAs·GaSb·AlSb material platform with epitaxy, device engineering, packaging and system integration.
Technology Platform
From epitaxy to delivery.
Material growth, wafer process, packaging and system integration are connected in one engineering chain.
About / Core Capabilities
A full‑chain IDM platform for next‑generation infrared photonics.
Founded in 2020, GK Semiconductor is a frontier optoelectronic wafer and chip developer and manufacturer focused on III‑V compound semiconductors, particularly antimonide materials and superlattice structures.
2020
Founded around III‑V antimonide and superlattice optoelectronics.
20,000 m²
Modern semiconductor fabrication and cleanroom footprint.
2×4″ + 1×6″
Three compound‑semiconductor process lines.
7 systems
InAs, GaSb, InGaAs, InAsSb, GaAs, InP and InSb.
Research collaborations & platform credentials
- National Semiconductor Laser Innovation Center
- CAS Institute of Semiconductors
Applications
One III-V platform,
applied across four fields.
Imaging, quantum measurement, laser processing and AI optical interconnect share one connected III-V platform.
Precision Material Processing
Laser energy for cutting, welding, marking and high-absorption material processing.
Datacenter Optical Interconnect
High-speed optical links connecting AI compute, switching and storage infrastructure.
Quantum Communication
Stable narrow-line sources for QKD and advanced photonic communication research.
Laser Ranging
Distance and spatial-reference measurement for imaging, inspection and research systems.
Featured Products
Explore our product portfolio.
A long-focal MWIR system, a megapixel cooled detector, and a high-power semiconductor laser bar, all from the published catalog.
Manufacturing & Quality
Built for scaled delivery.
Our manufacturing capabilities connect epitaxy, wafer processing, packaging and module delivery.
20,000+ m² footprint
Cleanroom and manufacturing space supports the documented engineering and production chain.
Connected engineering chain
Material growth, device engineering, packaging and system integration are organized as one platform.
Seven material systems
Materials capabilities span InAs, GaSb, InGaAs, InAsSb, GaAs, InP and InSb.